Image Part Manufacturer Description MOQ Stock Action
HSB07-202009 CUI Devices
HEAT SINK, BGA, 20 X 20 X 9 MM
1
RFQ
27,410
In-stock
Get Quote Buy Now
HSE-B1711-057 CUI Devices
HEAT SINK, EXTRUSION, TO-220, 25
1
RFQ
8,500
In-stock
Get Quote Buy Now
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