Image Part Manufacturer Description MOQ Stock Action
HSB03-121218 CUI Devices
HEAT SINK, BGA, 12 X 12 X 18 MM
1
RFQ
9,616
In-stock
Get Quote Buy Now
HSS14-B20-NP CUI Devices
HEAT SINK, STAMPING, TO-220, 19.
1
RFQ
45,313
In-stock
Get Quote Buy Now
HSB07-202009 CUI Devices
HEAT SINK, BGA, 20 X 20 X 9 MM
1
RFQ
27,410
In-stock
Get Quote Buy Now
HSB05-171711 CUI Devices
HEAT SINK, BGA, 17 X 17 X 11.5 M
1
RFQ
16,197
In-stock
Get Quote Buy Now
HSE-B1711-057 CUI Devices
HEAT SINK, EXTRUSION, TO-220, 25
1
RFQ
8,500
In-stock
Get Quote Buy Now
1 / 1 Page, 5 Records