Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSE06-503045 CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
1
RFQ
35,112
In-stock
Get Quote Buy Now
HSE07-753045 CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
1
RFQ
20,908
In-stock
Get Quote Buy Now
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