- Shape：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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2 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | 1 |
16,065
In-stock
|
Get Quote Buy Now | |||
|
|
CUI Devices | 1 |
32,941
In-stock
|
Get Quote Buy Now |
