Manufacturer:
Attachment Method:
Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSE08-505028 CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
1
RFQ
23,564
In-stock
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SAR175ASX50MM Sarnikon
EXTRUDED HEATSINK 28X50MM
1
RFQ
8,500
In-stock
Get Quote Buy Now
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