Attachment Method:
Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSS-B20-061H-03 CUI Devices
HEATSINK TO-220 2.9W ALUMINUM
1
RFQ
8,755
In-stock
Get Quote Buy Now
TGH-0130-03 t-Global Technology
ALUMINIUM HEAT SINK 35X13MM
1
RFQ
8,500
In-stock
Get Quote Buy Now
1 / 1 Page, 2 Records