- Manufacturer：
-
- CUI Devices (2)
- Sarnikon (3)
- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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9 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | 1 |
34,851
In-stock
|
Get Quote Buy Now | |||
|
|
Assmann WSW Components | 1 |
33,068
In-stock
|
Get Quote Buy Now | |||
|
|
CUI Devices | 1 |
26,805
In-stock
|
Get Quote Buy Now | |||
|
|
CUI Devices | 1 |
11,549
In-stock
|
Get Quote Buy Now | |||
|
|
Assmann WSW Components | 1 |
8,500
In-stock
|
Get Quote Buy Now | |||
|
|
Assmann WSW Components | 1 |
11,923
In-stock
|
Get Quote Buy Now | |||
|
|
Sarnikon | 1 |
18,589
In-stock
|
Get Quote Buy Now | |||
|
|
Sarnikon | 1 |
35,973
In-stock
|
Get Quote Buy Now | |||
|
|
Sarnikon | 1 |
21,191
In-stock
|
Get Quote Buy Now |
