- Manufacturer：
-
- CUI Devices (4)
- Ohmite (1)
- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
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- Material Finish：
-
8 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | 1 |
48,538
In-stock
|
Get Quote Buy Now | |||
|
|
CUI Devices | 1 |
21,018
In-stock
|
Get Quote Buy Now | |||
|
|
Assmann WSW Components | 1 |
36,624
In-stock
|
Get Quote Buy Now | |||
|
|
CUI Devices | 1 |
17,375
In-stock
|
Get Quote Buy Now | |||
|
|
CUI Devices | 1 |
11,553
In-stock
|
Get Quote Buy Now | |||
|
|
CUI Devices | 1 |
16,197
In-stock
|
Get Quote Buy Now | |||
|
|
Ohmite | 1 |
8,500
In-stock
|
Get Quote Buy Now | |||
|
|
Assmann WSW Components | 1 |
8,500
In-stock
|
Get Quote Buy Now |
