Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSB04-171706 CUI Devices
HEAT SINK, BGA, 17 X 17 X 6 MM
1
RFQ
21,018
In-stock
Get Quote Buy Now
HSB05-171711 CUI Devices
HEAT SINK, BGA, 17 X 17 X 11.5 M
1
RFQ
16,197
In-stock
Get Quote Buy Now
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