Product Status:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSS-C2540-SMT-TR CUI Devices
HEAT SINK TO-263 COPPER
1
RFQ
8,500
In-stock
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834000T00000 Comair Rotron
HEATSINK STAMP 19.4X25.4X11.4MM
1
RFQ
8,500
In-stock
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26176CTE Wakefield-Vette
HEATSINK SMT PKG
1
RFQ
8,500
In-stock
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