- Manufacturer:
-
- CUI Devices (2)
- Sarnikon (9)
- Material:
-
- Width:
-
- Attachment Method:
-
- Package Cooled:
-
- Fin Height:
-
- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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13 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | 1 |
21,602
In-stock
|
Get Quote Buy Now | |||
|
CUI Devices | 1 |
35,112
In-stock
|
Get Quote Buy Now | |||
|
CUI Devices | 1 |
23,564
In-stock
|
Get Quote Buy Now | |||
|
Assmann WSW Components | 1 |
8,500
In-stock
|
Get Quote Buy Now | |||
|
Sarnikon | 1 |
13,252
In-stock
|
Get Quote Buy Now | |||
|
Sarnikon | 1 |
15,137
In-stock
|
Get Quote Buy Now | |||
|
Sarnikon | 1 |
38,843
In-stock
|
Get Quote Buy Now | |||
|
Sarnikon | 1 |
20,965
In-stock
|
Get Quote Buy Now | |||
|
Sarnikon | 1 |
8,500
In-stock
|
Get Quote Buy Now | |||
|
Sarnikon | 1 |
8,500
In-stock
|
Get Quote Buy Now | |||
|
Sarnikon | 1 |
8,500
In-stock
|
Get Quote Buy Now | |||
|
Sarnikon | 1 |
8,500
In-stock
|
Get Quote Buy Now | |||
|
Sarnikon | 1 |
8,500
In-stock
|
Get Quote Buy Now |
