- Manufacturer：
-
- AMEC Thermasol (1)
- Cooling Source (2)
- CUI Devices (1)
- Wakefield-Vette (2)
- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
-
8 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | 1 |
36,141
In-stock
|
Get Quote Buy Now | |||
|
|
CUI Devices | 1 |
5,833
In-stock
|
Get Quote Buy Now | |||
|
|
t-Global Technology | 1 |
8,500
In-stock
|
Get Quote Buy Now | |||
|
|
Wakefield-Vette | 1 |
8,500
In-stock
|
Get Quote Buy Now | |||
|
|
Wakefield-Vette | 1 |
8,500
In-stock
|
Get Quote Buy Now | |||
|
|
AMEC Thermasol | 1 |
8,500
In-stock
|
Get Quote Buy Now | |||
|
|
Cooling Source | 1 |
32,488
In-stock
|
Get Quote Buy Now | |||
|
|
Cooling Source | 1 |
7,942
In-stock
|
Get Quote Buy Now |
