- Manufacturer：
-
- CUI Devices (1)
- Wakefield-Vette (3)
- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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5 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | 1 |
8,500
In-stock
|
Get Quote Buy Now | |||
|
|
Wakefield-Vette | 1 |
8,500
In-stock
|
Get Quote Buy Now | |||
|
|
Wakefield-Vette | 1 |
8,500
In-stock
|
Get Quote Buy Now | |||
|
|
Wakefield-Vette | 1 |
8,500
In-stock
|
Get Quote Buy Now | |||
|
|
CTS Electrocomponents | 1 |
8,500
In-stock
|
Get Quote |
