Image Part Manufacturer Description MOQ Stock Action
BDN10-3CB/A01 CTS Electrocomponents
HEATSINK CPU W/ADHESIVE 1.01"SQ
1
RFQ
8,646
In-stock
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HSS20-B20-NP CUI Devices
HEAT SINK, STAMPING, TO-218/TO-2
1
RFQ
12,670
In-stock
Get Quote Buy Now
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