Image Part Manufacturer Description MOQ Stock Action
HSB08-212106 CUI Devices
HEAT SINK, BGA, 21 X 21 X 6 MM
1
RFQ
29,723
In-stock
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371824B00032G Aavid, Thermal Division of Boyd Corporation
HEATSINK BGA W/ADHESIVE TAPE
1
RFQ
8,500
In-stock
Get Quote Buy Now
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