- Manufacturer:
-
- CUI Devices (2)
- Ohmite (1)
- Material:
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- Length:
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- Width:
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- Attachment Method:
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- Package Cooled:
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- Fin Height:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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8 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | 1 |
22,548
In-stock
|
Get Quote Buy Now | |||
|
Ohmite | 1 |
5,844
In-stock
|
Get Quote Buy Now | |||
|
Aavid, Thermal Division of Boyd Corporation | 1 |
6,603
In-stock
|
Get Quote Buy Now | |||
|
Advanced Thermal Solutions Inc. | 1 |
42,775
In-stock
|
Get Quote Buy Now | |||
|
Assmann WSW Components | 1 |
36,006
In-stock
|
Get Quote Buy Now | |||
|
CUI Devices | 1 |
8,500
In-stock
|
Get Quote Buy Now | |||
|
CUI Devices | 1 |
8,500
In-stock
|
Get Quote Buy Now | |||
|
CTS Electrocomponents | 1 |
8,500
In-stock
|
Get Quote Buy Now |
