- Manufacturer：
-
- CUI Devices (1)
- Wakefield-Vette (1)
- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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8 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | 1 |
26,542
In-stock
|
Get Quote Buy Now | |||
|
|
Aavid, Thermal Division of Boyd Corporation | 1 |
35,177
In-stock
|
Get Quote Buy Now | |||
|
|
Aavid, Thermal Division of Boyd Corporation | 1 |
47,316
In-stock
|
Get Quote Buy Now | |||
|
|
Assmann WSW Components | 1 |
9,879
In-stock
|
Get Quote Buy Now | |||
|
|
Advanced Thermal Solutions Inc. | 1 |
8,500
In-stock
|
Get Quote Buy Now | |||
|
|
Advanced Thermal Solutions Inc. | 1 |
8,500
In-stock
|
Get Quote Buy Now | |||
|
|
CUI Devices | 1 |
8,500
In-stock
|
Get Quote Buy Now | |||
|
|
Wakefield-Vette | 1 |
8,500
In-stock
|
Get Quote Buy Now |
