Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSE08-505028 CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
1
RFQ
23,564
In-stock
Get Quote Buy Now
HSE09-755028 CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
1
RFQ
8,500
In-stock
Get Quote Buy Now
1 / 1 Page, 2 Records