- Manufacturer：
-
- CUI Devices (2)
- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
4 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions Inc. | 1 |
8,500
In-stock
|
Get Quote Buy Now | |||
|
|
Advanced Thermal Solutions Inc. | 1 |
8,500
In-stock
|
Get Quote Buy Now | |||
|
|
CUI Devices | 1 |
8,500
In-stock
|
Get Quote Buy Now | |||
|
|
CUI Devices | 1 |
8,500
In-stock
|
Get Quote Buy Now |
