Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSB12-272706 CUI Devices
HEAT SINK, BGA, 27 X 27 X 6 MM
1
RFQ
15,020
In-stock
Get Quote Buy Now
HSB19-272718 CUI Devices
HEAT SINK, BGA, 27 X 27 X 18 MM
1
RFQ
8,500
In-stock
Get Quote Buy Now
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