Image Part Manufacturer Description MOQ Stock Action
HSB16-404018 CUI Devices
HEAT SINK, BGA, 40 X 40 X 18 MM
1
RFQ
40,946
In-stock
Get Quote Buy Now
HSB22-606010 CUI Devices
HEAT SINK, BGA, 60 X 60 X 10 MM
1
RFQ
8,500
In-stock
Get Quote Buy Now
1 / 1 Page, 2 Records