Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSS23-B20-NP CUI Devices
HEAT SINK, STAMPING, TO-218/TO-2
1
RFQ
12,021
In-stock
Get Quote Buy Now
HSS24-B20-NP CUI Devices
HEAT SINK, STAMPING, TO-218/TO-2
1
RFQ
42,066
In-stock
Get Quote Buy Now
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